The ups and downs of 2018 will soon pass. With the advent of the early winter of global semiconductor industry and the uncertainty of the international environment brought by the trade war, we have experienced a process from barbaric development to rational understanding and gradually adjusting the development strategy.
On the morning of August 31, the 2018 Microsemiconductor Summit was officially held in Haicang, Xiamen. The Summit focused on "the vane of industrial capital", with thousands of participants. Among them, more than 350 enterprises, 129 investment institutions and leaders of nearly 20 cities/development zones/high-tech zones from all parts of the country participated in the Summit. The Summit includes guest lectures and two round-table forums.
On the afternoon of May 11, Xiamen Semiconductor Investment Group Co., Ltd. (hereinafter referred to as Xiamen Semiconductor) and Hong Kong Jinbai Technology Co., Ltd. (hereinafter referred to as Jinbai Technology) signed an investment (M&A) agreement for high-density flexible substrates (flexible substrates) project in Haicang, Xiamen.
On the afternoon of April 16, 2018, Xiamen Haicang District People's Government and Xinzhou Science and Technology (Xiamen) Co., Ltd. signed a cooperative contract for the high-end packaging board project and the signing ceremony of the agreement between Xiamen Semiconductor Investment Group Co., Ltd. and Xinzhou Science and Technology (Xiamen) Co., Ltd. for capital increase and stock expansion was held in Xiamen. Xiamen Semiconductor Investment Group will invest in the development, design and manufacturing base of high-end packaging panels in Haicang District of Xiamen with Xinzhou Science and Technology.